Printed Circuit Boards: Technologies and Global Markets

Report Code: SMC103C

Publish Date: Oct 2022

Publisher: BCC Publishing

Category: Semiconductors

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Report Highlights

The global printed circuit boards market should reach $95.4 billion by 2027 from $74.0 billion in 2022 at a compound annual growth rate (CAGR) of 5.2% for the forecast period of 2022 to 2027.

Report Includes

  • 41 data tables and 37 additional tables
  • An up-to-date overview and analysis of the global markets for printed circuit boards (PCBs) and related electronics manufacturing technologies
  • Analyses of the global market trends, with market revenue data for 2021, estimates for 2022 and 2023, and projections of compound annual growth rates (CAGRs) through 2027
  • Highlights of the market potential for printed circuit boards, industry growth drivers, and areas of focus to forecast the global PCB market into various segments and sub-segments
  • Assessment of the underlying technological, environmental, legal/regulatory, and political trends that may influence the size and nature of the market
  • Estimation of the actual market size and market forecast for printed circuit board, and corresponding market share analysis based on type, assembly technology, material, end-use application, and region
  • Latest information on growth driving factors and opportunities in the consumer electronics industry, industry shifts and regulations, and other demographic and regional factors that will influence this market demand in the coming years (2022-2027)
  • Identification of the companies that are best positioned to meet this demand because of their proprietary technologies, strategic alliances, or other advantages
  • Market assessment of the COVID-19 impact on the global PCB industry, along with its implications on demand and supply, price impact and various government strategic decisions
  • Descriptive company profiles of the leading global players, including Advanced Circuits, CMK Corp., Meiko Electronics Co. Ltd., Nok Corp., Samsung Electro-Mechanics and TTM Technologies

Report Scope

The market scope is defined through consideration of PCB assembly technologies, types, PCB materials, end-user applications, and regions. PCB assembly technologies covered in the report include surface-mount and through-hole technology. The various types of PCBs covered in this report are high-density interconnects (HDI) PCBs, which further cover microvia and every layer of interconnecting PCBs; flexible PCBs are further categorized into single-sided, double-sided, and multilayer flex PCBs; multilayer rigid PCBs; and other PCB types include single-sided, double-sided, and rigid-flex PCBs.

This report highlights different PCB materials, including FR-4, CEM-3, polymide, polytetrafluoroethylene (PTFE), and others. Moreover, the report also provides an analysis of PCB materials by PCB types. The report also focuses on various end-user applications for PCBs, which include networking devices; healthcare; defense, surveillance, and aviation; energy; consumer electronics; computing and storage; industrial; automotive and transportation; retail; and others. In addition, the report also offers a major regional analysis of North America, Europe, Asia-Pacific, and the Rest of the World. The estimated and forecast market revenue and volume of each region are considered in this report. Moreover, the report also provides the average prices for PCBs by end-user applications.

This report also offers insights on drivers, restraints, and opportunities for the market, which were gathered through primary and secondary research. The report also covers COVID-19 impact as it had a massive impact on society since 2020. Also, the strategies adopted by companies in the PCB market are provided so readers can analyze ongoing trends in the market.

Report Synopsis

Report Metrics Details
Base year considered 2021
Forecast period considered 2022–2027
Base year market size $70.6 billion
Market size forecast $95.4 billion
Growth rate CAGR of 5.2% from 2022 to 2027
Units considered $ Millions
Segments covered Assembly Technology, Type, Material, End-User Application
Regions covered North America, Europe, Asia-Pacific and Rest of the World (RoW)
Countries covered U.S., Mexico, Canada, U.K., Germany, France, Rest of Europe, China, Taiwan, Japan, South Korea, India, Rest of Asia-Pacific, South America, Middle East and Africa
Key Market Drivers
  • Driverless Vehicles Driving Growth of the PCB Automotive Market
  • Surge in Electric Vehicle (EV) Sales in the Automotive Sector
  • IoT and the Demand Surge for Electronics
  • Asia-Pacific’s Rising Production of Electronic Devices and Accessories
Companies studied
CMK CORP.ADVANCED CIRCUITS
AGYAT&S
COHU INC.COMPEQ
DYNAMIC ELECTRONICS CO. LTD.I3 ELECTRONICS INC.
MEIKO ELECTRONICS CO. LTD.NAN YA PCB CORP.
NOK CORP.SAMSUNG ELECTRO-MECHANICS
SANMINA CORP.SHENGYI TECHNOLOGY CO. LTD.
SHINKO ELECTRIC INDUSTRIES CO. LTD.SUMITOMO ELECTRIC INDUSTRIES LTD.
TRIPOD TECHNOLOGY CORP.TTM TECHNOLOGIES INC.
UNIMICRON TECHNOLOGY CORP.ZHEN DING TECHNOLOGY HOLDING LTD.
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Analyst Credentials

BCC Research Team possesses expertise and experience in life and physical science domains. They specialize in offering valuable business insights, including industry analysis, competitor intelligence, strategic and financial analysis, and opportunity assessment. The team has in-depth knowledge of various sectors, including healthcare, biotechnology, pharmaceuticals, IT, automation, advanced materials, and energy. They are proficient in qualitative and quantitative market intelligence providing clients with actionable insights. With a vast understanding of the competitive landscape, the team can support clients in making data-driven decisions to help them achieve a competitive edge in their respective markets.

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Table of Contents

All reports provided in PDF format. For shared licensing options (5+ Users), please call a representative at (+1) 781-489-7301 or contact us at info@bccresearch.com
. Title/Chapter NamePagesPrice Member Price
Full Report: Printed Circuit Boards: Technologies and Global Markets148 $2,500 Free
Chapter- 1: Introduction9Free
Chapter- 2: Summary and Highlights2$250Free
Chapter- 3: Market Overview13$221Free
Chapter- 4: Market Breakdown by Assembly Technology3$51Free
Chapter- 5: Market Breakdown by Type6$102Free
Chapter- 6: Market Breakdown by Material5$85Free
Chapter- 7: Market Breakdown by End-User Application35$595Free
Chapter- 8: Market Breakdown by Region30$510Free
Chapter- 9: Competitive Landscape5$85Free
Chapter- 10: Company Profiles39$663Free
Chapter- 11: Appendix: List of Acronyms1$17Free
Published - Oct-2018| Analyst - BCC Publishing| Code - SMC103B

Report Highlights

The global market for printed circuit board should grow from $64.6 billion in 2018 to reach $75.8 billion by 2023 at a compound annual growth rate (CAGR) of 3.2% for the period of 2018-2023.

Report Includes

  • 113 tables
  • An overview of the global market for Printed Circuit Board (PCB)
  • Analyses of global market trends, with data from 2017, estimates for 2018 and projections of CAGRs through 2023
  • Definition, types and characteristics of PCB adoption in end applications
  • Discussion of the influence of internet of things (IoT), automotive and manufacturing sectors to the growth of PCB industry
  • Company profiles of major players in the market, including Nippon Mektron, Zhen Ding Technology Holding Limited, TTM Technologies, Young Poong Electronics Co., Ltd., Unimicron Technology Corp., and Samsung Electro-Mechanics
Published - Jun-2016| Analyst - Kaustubha Parkhi| Code - SMC103A

Report Highlights

The global market for printed circuit boards (PCBs) reached nearly $61.5 billion in 2015. The market is expected to reach nearly $73.8 billion by 2021 from $63.5 billion in 2016, increasing at a compound annual growth rate (CAGR) of 3.1% from 2016 to 2021.

Report Includes

  • An overview of the global markets and related technologies for printed circuit boards.
  • Analyses of global market trends, with data for 2015, estimates for 2016, and projections of CAGRs through 2021.
  • Breakdowns and analysis by structure: 
    • Multilayer
    • Flexible
    • Rigid-flex
    • Microvia
    • Substrate 
  • Breakdowns by application: 
    • Telecommunications
    • Medicine
    • Computing and entertainment
    • Consumer electronics
    • Instrumentation and scientific research
    • Energy, defense, and surveillance
    • Industrial and automotive
  • Analysis of the value chain including looks at material specialists, board makers, engineering manufacturing service providers and OEMs.
  • Profiles of major players in the industry.

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Printed Circuit Boards: Technologies and Global Markets
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